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EPM3064A芯片技术解密分析

时间:2011-03-30 09:02:00

芯片解密过程中,对芯片内部结构及其加解密特征进行技术分析是解密工程师的一项必修课,因为只有充分理解芯片内部结构原理等技术信息,工程师才能准确进行方案开发,确定最可靠、成功率最高的解密方案,最大限度确保解密项目的安全可靠。
EPM3064A芯片特点:
High- performance, low- cost CMOS EEPROM- based programmab
architecture (see Table1)
logic devices (PLDs) built on a MAX 3.3-V in-system programmability (ISP) through the built- inIEEE Std. 1149.1 Joint Test Action Group (JTAG) interface with advanced pin-locking capability
- ISP circuitry compliant with IEEE Std. 153 Built- in boundary-scan test (BST) circuitry compliant with
IEEE Std. 1149.1-1990 Enhanced ISP features:
- Enhanced ISP algorithm for faster programmin
- ISP_Done bit to ensure complete programmin
- Pull-up resistor on I/O pins during in- system programmi High- density PLDs ranging from 600 to 10,000 usable gates 4.5- ns pin- to- pin logic delays with counter frequencies of up 227.3MHz
TM MultiVolt  I/O interface enabling the device core to run at 3.3 V, while I/O pins are compatible with 5.0- V, 3.3- V, and 2.5- V log
levels Pin counts ranging from 44 to 256 in a variety of thin quad flat pack (TQFP), plastic quad flat pack (PQFP), plastic J- lead chip carrier
TM packages
(PLCC), and FineLine BGA Hot- socketing suppor Programmable interconnect array (PIA) continuous routing structure for fast, predictable performance
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